Everyday heat conduction

In heat transfer, heat conduction is the process by which solids bring heat to the surface. Heat conduction provides a temperature equalisation in the body and as such is a prerequisite for the other types of heat transfer of convection and radiation, since ultimately these rely on the temperature differences between the surface and the environment.

The structures that are to be heated or cooled give off a heat flux. They are essentially different from structures that use insulation to keep the heat flux small.

Increase conduction - e.g. computer fans:

The heat occurring in the processor should be dissipated as effectively as possible by the CPU fan. The structure in this case ensures that the heat is conducted via the maximum possible area and the distance to heat dissipation is kept as small as possible.

Good heat-conducting materials such as copper or aluminium are preferred.

A large temperature difference allows large heat fluxes. This temperature however is limited by the ambient temperature and the maximum permitted temperature of the processor.

All parameters (length, area, material and temperature difference) are adapted to the application.

Reduce heat conduction e.g. in pipe insulation:

The heat flux of a pipe to the environment should be minimised by insulation. For this purpose an insulating material is wrapped around the pipe.

Typical materials are foamed and thus poor heat conductors.

The thickness of insulating material is chosen to be sufficiently large so that the temperature difference to the outside no longer permits large heat fluxes.

All parameters (length, area, material and temperature difference) are adapted to the application.